The evolution of electronic devices with the tendency towards miniaturization has a definite influence on the packaging market – the latest trend being a visible increase in the market for ESD foam packaging. This key information and several valuable details connected with professional packaging for the electronics industry can be found in the latest report published by Transparency Market Research.
An Estimated ESD Foam Packaging Market Expansion with 6.3% CAGR
The estimations published in the TMR report cover the period 2017-2022. During these five years, the market research specialists appreciate that the key driving force behind the growth of the ESD foam packaging market is the continuous development of the mobile technology market.
Powerful smartphones and tablets will lead to complex changes in the entire electronics industry. The main trend imposed by these smart devices is that of miniaturization. Smaller computing devices, which are easy to carry and use on the go are in demand by industries where mobility has become the new working standard. Logistics, manufacturing, distribution and warehousing are among the industries which demand an advanced computing power in an ergonomic and lightweight body.
Speaking in numbers, the market for ESD foam packaging materials has reached the value of $172.5 million and is expected to reach $233.8 million by 2022. These numbers indicate an average compound annual growth rate (CAGR) of 6.3%.
Two Distinct Growth Sectors
Logistic Packaging experts have studied the TMR report and recognized two key areas of development which will contribute to the growth of the ESD foam packaging market. On one hand, we are talking about the electronics parts and components. On the other hand, electrical devices will also follow the miniaturization trend and will require customized foam applications for safe packaging.
A few useful insights from the report:
- There is a growing demands for the development of miniature semiconductor integrated circuits at global level
- The most active industries behind the worldwide demand for electronics are: aerospace, manufacturing, defense/ military, automotive, electrical devices and electronics;
- The Asia-Pacific area, excluding Japan, is foreseen to have the highest expansion on the ESD foam packaging market, with a 5.8% CAGR; towards the end of the analyzed period, Japan and the EMEA region (Europe, Middle East and Africa) will allegedly experience a decline on this specialized packaging market.
The Role and Importance of ESD Foam Packaging
ESD foam packaging materials are customized packages which are designed to offer a tight, secure fit to sensitive electronic instruments, parts and components. These foam applications have specific shaped cut-outs which follow the shape of the products which will be placed inside them.
In their turn, foam packages for electronics are placed in ESD containers or trays. Thus, the electronic products are completely protected from: electrostatic discharges, dust, shocks, vibrations, scratching, breakage, spillage, etc. This is the most secure modality of packaging electronic devices for transport and storage, both within the logistic loop of complex manufacturing processes and for the final delivery to stores and the end customers.
ESD foam packaging can be manufactured in any size and shape depending on the customers’ specifications. At Logistic Packaging, we can provide our customers with:
- Molded foam
- Separators inside boxes
- Adhesive foam pads
- Foam boxes
- Cut-outs for very fragile items.